Chemical-Mechanical Planarization of Semiconductor Materials

Chemical-Mechanical Planarization of Semiconductor Materials

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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.One method is to place dummy features into open spaces within the circuit layout. ... They are constrained to specific areas based on physical and electrical design rules. ... The optimum placement of dummy structures (also referred to as tiling) into an entire chip layout is an iterative procedure: (1) analyze pattern density, anbsp;...

Title:Chemical-Mechanical Planarization of Semiconductor Materials
Author: M.R. Oliver
Publisher:Springer Science & Business Media - 2013-03-14

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